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Celcon® MC270-HM
乙缩醛（POM）共聚物
Ticona
产品说明
Celcon® MC270-HM is a high modulus, mineral coupled acetal copolymer. It utilizes a higher additive level to provide significant improvement in product stiffness and mold shrinkage and better warpage resistance than unfilled Celcon® M270. Celcon® MC270-HM is formulated to produce very flat, dimensionally stable parts.
总体
材料状态 • 已商用：当前有效
供货地区 • 北美洲 • 拉丁美洲 • 南美洲
填料/增强材料 • 矿物填料
性能特点 • 尺寸稳定性良好 • 刚性，高 • 共聚物
RoHS 合规性 • 联系制造商
形式 • 颗粒料
加工方法 • 注射成型
物理性能 额定值单位制 测试方法
比重
-- 1.60g/cm³ ASTM D792
-- 1.57g/cm³ ISO 1183
收缩率
流动 1.5% ASTM D955
横向流动 1.2% ASTM D955
横向流量 1.3% ISO 294-4
流量 1.5% ISO 294-4
吸水率 ISO 62
饱和, 23°C 0.75%
平衡, 23°C, 50% RH 0.20%
机械性能 额定值单位制 测试方法
拉伸模量 3750MPa ISO 527-2/1A/1
抗张强度
屈服, 23°C 44.1MPa ASTM D638
屈服 45.0MPa ISO 527-2/1A/50
拉伸应变 (屈服) 5.0% ISO 527-2/1A/50
弯曲模量
23°C 3450MPa ASTM D790
23°C 3700MPa ISO 178
弯曲强度 (23°C) 77.0MPa ISO 178
冲击性能 额定值单位制 测试方法
简支梁缺口冲击强度 ISO 179/1eA
-30°C 3.5kJ/m²
23°C 4.8kJ/m²
悬壁梁缺口冲击强度
-40°C 32J/m ASTM D256
23°C 48J/m ASTM D256
82°C 48J/m ASTM D256
23°C 5.3kJ/m² ISO 180/1A
热性能 额定值单位制 测试方法
热变形温度
1.8 MPa, 未退火 97.2°C ASTM D648
1.8 MPa, 未退火 105°C ISO 75-2/A
维卡软化温度 161°C ISO 306/B50
熔融温度 2 165°C ISO 11357-3
ASTM D3418
线形膨胀系数 ISO 11359-2
流动 0.000060cm/cm/°C
横向 0.000090cm/cm/°C
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Celcon® MC270-HM 2012年10月14日
乙缩醛（POM）共聚物
Ticona
注射 额定值单位制
加工（熔体）温度 182 到 199°C
模具温度 82.0 到 93.0°C
注射说明
Standard reciprocating screw injection molding machines with a high compression screw (minimum 3:1 and preferably 4:1) and low back pressure (0.35 Mpa/50 PSI) are favored. Using a low compression screw (I.E. general purpose 2:1 compression ratio) can result in unmelted particles and poor melt homogeneity. Using a high back pressure to make up for a low compression ratio may lead to excessive shear heating and deterioration of the material.
Melt Temperature: Preferred range 182-199 C (360-390 F). Melt temperature should never exceed 230 C (450 F).
Mold Surface Temperature: Preferred range 82-93 C (180-200 F) especially with wall thickness less than 1.5 mm (0.060 in.). May require mold temperature as high as 120 C (250 F) to reproduce mold surface or to assure minimal molded in stress. Wall thickness greater than 3mm (1/8 in.) may use a cooler (65 C/150 F) mold surface temperature and wall thickness over 6mm (1/4 in.) may use a cold mold surface down to 25 C (80 F). In general, mold surface temperatures lower than 82 C (180 F) may hinder weld line formation and produce a hazy surface or a surface with flow lines, pits and other included defects that can hinder part performance.
备注
1 一般属性：这些不能被视为规格。
2 10°C/min
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